| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting a semiconductor device capable of accurately and easily inspecting a chip pattern formed in a wafer. SOLUTION: The method for inspecting the semiconductor device includes the steps of: inspecting by contacting a probe to a pad of a contact check pattern formed in the wafer with the chip pattern; and inspecting by contacting the probe to the pad of the chip pattern if the inspection result is within the predetermined range. As the contact check pattern, the one is used having the same dimension as the chip pattern, having an appearance different from that of the chip pattern, and having the pad having the same pattern as the pad of the chip pattern. COPYRIGHT: (C)2007,JPO&INPIT
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