Chemical vapor deposition device for coating a substrate comprises a unit for electrostatically discharging or polarizing particles in the gas phase using an electrostatic field within a chamber to keep the particles from a substrate holder

摘要

Chemical vapor deposition (CVD) device comprises a gas inlet (1) for introducing a process gas consisting of one or more reactants into a process chamber (2) with a substrate holder (4) arranged below a chamber roof (3) for supporting one or more substrates to be treated. The gas passing in the horizontal direction of the chamber is removed from the chamber using an outlet device (6). A unit electrostatically discharges or polarizes particles in the gas phase using an electrostatic field within the chamber to keep the particles from the substrate holder.