| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high radiation sensitivity and sufficiently high resolution, excels in adhesion to a substrate, a base or an upper layer, suppresses generation of a sublimate during baking in a film forming process, ensures a large development margin, and can be suitably used for forming an interlayer insulation film or microlenses. <P>SOLUTION: The radiation-sensitive resin composition contains (A) a polymer obtained by living radical polymerization in the presence of a specific thiocarbonyl thio compound and having carboxyl groups, wherein the ratio (Mw/Mn) between weight average molecular weight (Mw) and number average molecular weight (Mn) in terms of polystyrene measured by gel permeation chromatography is ≤1.7, and (B) a 1,2-quinonediazido compound. <P>COPYRIGHT: (C)2007,JPO&INPIT |
