发明名称 |
APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and method of mounting electronic components which can stack electronic components on a substrate and mount them. <P>SOLUTION: A plurality of mounting positions and mounting reference heights of electronic components on the substrate are represented by three-dimensional data of XYZ coordinate values consisting of pattern coordinates and block coordinates, the transfer operations of the electronic components are controlled based on the three-dimensional data. Thus, a plurality of kinds of electronic components are stacked with the same pattern on a plurality of regions segmented on one substrate, and can perform stack mounting. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007129129(A) |
申请公布日期 |
2007.05.24 |
申请号 |
JP20050321970 |
申请日期 |
2005.11.07 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TSUJISAWA TAKAFUMI;YOSHIDA HIROYUKI |
分类号 |
H05K13/04;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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