发明名称 APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus and method of mounting electronic components which can stack electronic components on a substrate and mount them. <P>SOLUTION: A plurality of mounting positions and mounting reference heights of electronic components on the substrate are represented by three-dimensional data of XYZ coordinate values consisting of pattern coordinates and block coordinates, the transfer operations of the electronic components are controlled based on the three-dimensional data. Thus, a plurality of kinds of electronic components are stacked with the same pattern on a plurality of regions segmented on one substrate, and can perform stack mounting. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007129129(A) 申请公布日期 2007.05.24
申请号 JP20050321970 申请日期 2005.11.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUJISAWA TAKAFUMI;YOSHIDA HIROYUKI
分类号 H05K13/04;H01L25/065;H01L25/07;H01L25/18 主分类号 H05K13/04
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