| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package and a semiconductor device with which ventilation sections, if provided, to communicate with the inside of a cavity can be constantly and stably formed in their shape, foreign matters can be effectively prevented from entering, and even a structure without a lead frame can be applied. <P>SOLUTION: When the cavity 10 is formed in a package body 2, for example, a plurality of ventilation sections 1 are formed around a position for fixing a semiconductor element 3 on the package body 2 at positions corresponding to side faces or a bottom face of the cavity 10. The ventilation section 1 is a through-hole including a bent structure, so that internal dew condensation can be prevented and mixture of the foreign matters can also be prevented. For example, a light receiving semiconductor device 30 can be formed for receiving light by the semiconductor element 3 from a glass substrate 5, using the semiconductor package. <P>COPYRIGHT: (C)2007,JPO&INPIT |
