发明名称 METHOD OF MOUNTING ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic part by which floating of parts during a mounting step can be prevented without causing any influence on a substrate or a terminal. <P>SOLUTION: When an electronic part 1 is inserted and mounted to a printed board 2, the lead terminal 12 of the electronic part 1 is clinched on the rear surface of the printed board 2. In concrete, the terminal hole 21 of the printed board 2 is comprised of a hole-shape 21a to which the lead terminal of the electronic part is inserted, and a penetrated groove 21b which is extended from the hole-shape 21a in the clinching direction and is smaller in width than the hole-shape 21a. The lead terminal 12 of the electronic part is inserted into the hole-shape 21a, and it is clinched on the rear surface of the printed board 2. Thus, the lead terminal 12 can be inserted into the penetrated groove 21b at small spacing. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007128975(A) 申请公布日期 2007.05.24
申请号 JP20050318624 申请日期 2005.11.01
申请人 CALSONIC KANSEI CORP 发明人 MIYASAKA HIROSHI
分类号 H05K13/04 主分类号 H05K13/04
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