EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

This invention provides an epoxy resin composition, which causes no significant warpage after molding in an area mounting-type semiconductor device and during solder treatment, causes no significant warpage in a low-temperature state, for example, in a temperature cycle test, and possesses excellent flame retardancy, solder cracking resistance, and fluidity, and a semiconductor device using the same. The epoxy resin composition for use in the semiconductor device comprises as indispensable components at least one epoxy resin (A) selected from trifunctional epoxy resins and tetrafunctional epoxy resins, a curing agent (B) containing at least two hydroxyl groups per molecule, a compound (C) containing at least two cyanate groups per molecule, and an inorganic filler (D).