| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame producing a semiconductor device in which overall thickness dimension can be reduced. SOLUTION: The lead frame used for assembling a semiconductor device 27 is constituted by stacking a first lead frame 5 provided, in the central portion thereof, with a die pad 3 for mounting a semiconductor chip 21, and a second lead frame 9 provided with a plurality of leads 7 arranged around the die pad 3 wherein the first lead frame 5 is provided with a lead 17. COPYRIGHT: (C)2007,JPO&INPIT
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