| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency wireless module that can be inexpensively manufactured by downsizing the module shape and increasing the number of module boards manufactured at a time in the case of manufacturing the module boards in a multiple board state. <P>SOLUTION: Electronic components such as an IC 121 and a passive element 122 for configuring a wireless transmission reception function section are mounted on the module board 101, and they are sealed by an electric insulating sealing member 102. Further, a shield electrode 131 is provided inside the sealing member 102. Moreover, an antenna conductor 103 formable of a planar pattern such as an inverted-F antenna or a patch antenna is provided to an upper side of the sealing member 102, and a connection conductor 132 is used to electrically connect the antenna conductor 103 to a wiring 112 inside the module board 101 or the electronic components 121, 122 embedded in the sealing member 102. <P>COPYRIGHT: (C)2007,JPO&INPIT |
