| 摘要 |
<P>PROBLEM TO BE SOLVED: To stabilize a formability of a resin when making a resin sealing in a resin-sealing semiconductor package device. <P>SOLUTION: In the semiconductor package device that chips 10 with a group of bonding pads mounted on one side on lead frames 11 and sealed with a resin 15; the lead frames 11 have a pair of inside lead groups 11a, 11b, and the chips 10 are mounted on the longer inside lead group 11b and hanging pins 11f through organic insulating films 12 of the back. The semiconductor device is composed in such manner that the hanging pins 11f are connected with the outermost inner leads of the longer inner leads 11b, and are fixed on the back of the chips 10 to stably hold the chips 10. <P>COPYRIGHT: (C)2007,JPO&INPIT |
