Verfahren zur Herstellung eines Bauelementes mit mehreren Chips sowie ein solches Bauelement

摘要

The present invention relates to a method and apparatus for producing a chip arrangement. In one embodiment, the method includes providing a first chip having an electrically operable structure, of providing at least one through-via through the first chip, and of arranging at least one bond wire through the through-via in the first chip.