发明名称 |
Interconnection element for BGA housings and method for producing the same |
摘要 |
An electronic component includes an interposer substrate and at least one semiconductor chip mounted on the interposer substrate. A plurality of electrical connections electrically couple a rewiring of the interposer substrate to contact regions of the at least one semiconductor chip. A plurality of connection elements are positioned for electrical contact-connection with a printed circuit board. The interconnection elements comprise hollow-cylindrical or rod-shaped elements that penetrate through and are fixedly connected to the interposer substrate. |
申请公布号 |
US7220666(B2) |
申请公布日期 |
2007.05.22 |
申请号 |
US20040944684 |
申请日期 |
2004.09.17 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HANKE ANDRE;DOBRITZ STEPHAN |
分类号 |
H01L21/4763;H01L23/31;H01L23/498;H05K3/00;H05K3/22;H05K3/34;H05K3/40 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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