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发明名称
BGA TYPE SEMICONDUCTOR CHIP PACKAGE HAVING SECTIONALLY SOLDER BALL WITH IN PLASTIC CORE
摘要
申请公布号
KR20070052043(A)
申请公布日期
2007.05.21
申请号
KR20050109595
申请日期
2005.11.16
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, JONG UNG;KIM, HEUI SEOG;KIM, SANG JUN;SIN, WHA SU;LEE, JUN YOUNG;KIM, JUNG HYEON;KIM, MIN JUNG
分类号
H01L21/60;H01L23/28
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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