| 摘要 |
The invention relates to a microphone with a miniaturized design that, on a first surface of a flat carrier substrate, supports an electroacoustic transducer placed above a recess of the carrier substrate. On the second surface of the carrier substrate, the recess is spanned by a cap, which rests upon the carrier substrate and tightly seals with the surface of the carrier substrate and which has at least one metallic layer for electromagnetically shielding. Semiconductor components can be placed under the cap that assist or ensure the function of the microphone. |
