METHOD FOR FORMING METAL FILM AND METHOD FOR FORMING METAL PATTERN

摘要

Disclosed is a method for forming a metal film which is characterized by comprising a step (a1) for forming, on a substrate, a polymer layer composed of a polymer which has a functional group interacting with a metal ion or a metal salt and is chemically bonded to the substrate directly; a step (a2) for providing the polymer layer with a metal ion or a metal salt; a step (a3) for forming a conductive layer having a surface resistivity of 10-100 kO/? by reducing the metal ion or the metal salt; and a step (a4) for forming a conductive layer having a surface resistivity of 1 × 10^-1 O/? or less by electroplating.