发明名称 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
摘要 |
A semiconductor device includes: a semiconductor substrate in which an integrated circuit is formed; an interconnect layer which includes a linear section and a land section connected with the linear section; and an underlayer disposed under the interconnect layer, and the land section includes a first section which is in contact with the underlayer, and a second section which is not in contact with the underlayer.
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申请公布号 |
US7218008(B2) |
申请公布日期 |
2007.05.15 |
申请号 |
US20040880352 |
申请日期 |
2004.06.29 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KUROSAWA YASUNORI |
分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L23/31;H01L23/48;H01L23/485;H01L29/40;H05K1/11;H05K3/10;H05K3/34;H05K3/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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