| 发明名称 |
Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic device |
| 摘要 |
Exemplary embodiments of the invention to provide an efficient and productive method to form a reliable film. A method to form a film according to exemplary embodiments of the present invention, in which a transferring layer formed on a substrate is transferred to a workpiece to form a predetermined film on the workpiece, includes treating a surface of the workpiece to enhance or improve the adhesion between the transferring layer and the workpiece by chemical interaction. |
| 申请公布号 |
US7217334(B2) |
申请公布日期 |
2007.05.15 |
| 申请号 |
US20040933438 |
申请日期 |
2004.09.03 |
| 申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TOYODA NAOYUKI |
| 分类号 |
B44C1/00;G03F7/34;B05D1/28;B05D5/12;B05D7/00;B29C65/48;B32B27/16;B32B38/10;G01C3/00;H01J9/02;H01J11/02;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01L21/20;H01L21/26;H01L21/28;H01L21/288;H01L21/3205;H01L21/336;H01L21/36;H01L21/768;H01L29/786;H01L51/50;H05B33/10;H05K3/04;H05K3/20;H05K3/38 |
主分类号 |
B44C1/00 |
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