RADIATOR PLATE AND SEMICONDUCTOR DEVICE

摘要

A radiator plate 20 is mounted on a back surface of a semiconductor element 11 on a substrate 10 so that heat is radiated from the semiconductor element 11 . The radiator plate 20 includes first radiating fins 20 b formed on the one side which is opposite to the surface facing the substrate 10 and second radiating fins 20 c formed on the other side which faces the substrate 10 . The second radiating fins 20 c are arranged in the same direction as the first radiating fins 20 b and at positions not interfering the semiconductor element 11.