DEVICE AND METHOD FOR MATERIAL SEPARATION USING LASER PULSES, THE ENERGY OF ONE OF WHICH IS LESS THAN THE ENERGY OF A LASER PULSE USED FOR SEPARATING MATERIAL

摘要

The invention relates to a method for material separation using a laser, whereby a sequence of laser pulses (11 to 20) is produced and an area of a material to be treated is irradiated with the sequence of laser pulses (11 to 20). Methods of this type are used to separate a number of different materials. Known methods are problematic in that the surroundings of the area of treatment are thermally or mechanically damaged, leading to non-treated areas of the material being impaired. In order to address this problem, the laser pulse energy of an individual laser pulse of the sequence of laser pulses (11 to 20) is lower than the laser pulse energy required to produce a material separation using an isolated laser pulse in the area irradiated with the individual laser pulse of the sequence of laser pulses (11 to 20).