发明名称 Photosensitive element, resist pattern formation method and printed wiring board production method
摘要 The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, the photosensitive resin composition contains a thioxanthone-based compound represented by the following general formula (I) as the component (C), and when the parts by weight of the thioxanthone-based compound relative to 100 parts by weight for the total weight of the component (A) and the component (B) is taken to be P, and the film thickness of the photosensitive resin composition layer is taken to be Q (mum), then R, which is the product of P and Q, satisfies the condition of the following formula (1). In the following general formula (I), R<SUP>1 </SUP>to R<SUP>8 </SUP>represent a hydrogen atom, halogen atom or hydrocarbon group. <?in-line-formulae description="In-line Formulae" end="lead"?>25.5<=R<=79.0 (1) <?in-line-formulae description="In-line Formulae" end="tail"?> [Chemical Formula I]
申请公布号 US2007105036(A1) 申请公布日期 2007.05.10
申请号 US20040572859 申请日期 2004.09.17
申请人 KUMAKI TAKASHI;MIYASAKA MASAHIRO;ICHIHASHI YASUHISA;ITO TOSHIKI;KAJI MAKOTO 发明人 KUMAKI TAKASHI;MIYASAKA MASAHIRO;ICHIHASHI YASUHISA;ITO TOSHIKI;KAJI MAKOTO
分类号 G03C1/00;C08F2/50;G03F7/029;G03F7/031 主分类号 G03C1/00
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