| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a sensor capable of enhancing connection reliability, and also provide the sensor. SOLUTION: In this method of manufacturing the sensor 100, at least one out of a connection portion 113 of a semiconductor wafer 114 and a connection portion 122 of a cap member 123 is formed unevenly, the cap member 123 is formed to follow a set of dies 140 having a prescribed shape of molding face, and the cap member 123 is bonded positioningly to the semiconductor wafer 114, under the condition where the cap member 123 is held by one side die 141. COPYRIGHT: (C)2007,JPO&INPIT
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