| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board that allows flatness of solder and has high soldering reliability in semiconductor components. <P>SOLUTION: In the circuit board, an extension pattern 6 exposed from an insulating cover 7 is provided at the side of an NC land 5 where no electric signal flows, so that it has a configuration equivalent to that of a pattern 3 exposed from the insulating cover 7 at the side of a land 4 where an electric signal flows. An exposed surface area at the side of the NC land 5 is made equal to that at the side of the land 4. When the semiconductor components 8 are subjected to soldering 10, the pile-up of the solder 10 at the side of the NC land 5 is made equal to that at the side of the land 4, thus achieving planarity (coplanarity) in the solder 10 and improving reliability in the soldering of the semiconductor components 8. <P>COPYRIGHT: (C)2007,JPO&INPIT |
