| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an antireflection film that can be thermally cured without using a crosslinking material or a crosslinking catalyst and sufficiently suppress wafer defects induced by a sublimated material. <P>SOLUTION: The composition for formation of an antireflection film for lithography contains an addition polymerizable resin having a repeating unit (A) containing a carbon-carbon multiple bond. The repeating unit (A) containing a carbon-carbon multiple bond is a repeating unit containing at least one double bond in a side chain. The repeating unit (A) containing a carbon-carbon multiple bond is a repeating unit containing an α, β-unsaturated carbonyl bond on a side chain. The addition polymerizable resin contains a repeating unit (A) having thermosetting property and containing a carbon-carbon multiple bond and a repeating unit (B) having light absorbing property and containing an aromatic ring, with the repeating unit (A) contained by ≥0.01 molar ratio in the entire unit structures constituting the resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
