| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic cap which is not removed even if a mechanical force is applied to a ceramic package for housing electronic devices connected to a board or the like, and which can meet demands such as downsizing, high reliability, cost reduction, etc. SOLUTION: The ceramic cap 10 is provided with a glass bonding section 12 for sealing on the entire circumference of one main surface of a ceramic substrate 11, and an electronic part 22 is bonded to a ceramic substrate 21 by glass that is mounted to a cavity 23, so as to seal the cavity 23 hermetically. In this case, a recess 13 is provided along the inner circumferential edge of the glass bonding section 12 for sealing on one main surface of the ceramic substrate 11. COPYRIGHT: (C)2007,JPO&INPIT
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