| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treatment method capable of carrying out plasma treatment, using a simple device structure. <P>SOLUTION: In a first step, a treating object 10 having conductivity is arranged, facing a dielectric 24 covering the surface of an HOT electrode 22 that impresses voltage. In a second step, a treatment gas is supplied to the space 25 between the dielectric 24 and the treating object 10. In a third step, voltage is impressed on the HOT electrode 22, electric discharge is generated between the HOT electrode 22 and the treating object 10, and the treating gas which becomes plasmatic by discharge is made to contact the surface 11 of the treating object 10, and the surface 11 of the treating object 10 is plasma-treated. <P>COPYRIGHT: (C)2007,JPO&INPIT |
