| 发明名称 |
Dry thermal grease |
| 摘要 |
A heat sink material for use in electronic assemblies is disclosed. The heat sink material is a thermal grease that due its composition is dry to the touch and thus eliminates the problems associated with thermal greases in electronic assemblies.
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| 申请公布号 |
US6475962(B1) |
申请公布日期 |
2002.11.05 |
| 申请号 |
US20000661729 |
申请日期 |
2000.09.14 |
| 申请人 |
AOS THERMAL COMPOUNDS, LLC |
发明人 |
KHATRI PRAKASH |
| 分类号 |
C09K5/14;H01L23/373;(IPC1-7):C10M113/00;F28F7/00;H05K7/20 |
主分类号 |
C09K5/14 |
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