| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an acceleration sensor chip capable of preventing a metal wire from being dissolved. <P>SOLUTION: The method includes a step of preparing a semiconductor substrate 20 with a plurality of partitioned chip areas, a step of fabricating a functional element 17, a step of forming the wire 36, a step of forming a wire protection film 37 for coating the wire, a step of forming a movable part 14 fixed by a sacrifice layer 22 and the first semiconductor layer 21, and a step of forming a groove part 28 having a depth within a thickness of the first semiconductor layer from a surface of the first semiconductor layer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
