| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board which avoids thermal damage to an insulating layer, and also to provide a high-performance electronic component using the flexible wiring board. SOLUTION: A heat-resistant resin layer 200 and metal foil layers 301, 302 are laminated in this order at least on one surface of a polycarbonate polyurethane resin layer 100 containing an isocyanurate compound as a curing agent. The metal foil layers 301, 302 are patterned. COPYRIGHT: (C)2007,JPO&INPIT |
