| 摘要 |
A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12 a , 12 b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11 . In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11 , the radiator plates 12 a , 12 b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12 a , 12 b can be supported by the circuit board 11.
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