| 摘要 |
A method for improving the heat stability of polyparaxylylene and a derivative film thereof to improve the heat resistance of the polyparaxylylene and the derivative film thereof without deteriorating deposition characteristics or profitability, and a polyparaxylylene derivative whose heat resistance is improved are provided. When the polyparaxylylene or the derivative film thereof represented by a below-described general formula 1 is formed by a chemical vapor deposition method, an amino-(2.2)-paracyclophane compound represented by a below-described general formula 3 is mixed in a (2.2)-paracyclophane compound represented by a below-described general formula 2 to form a film. (In the formula 1, X<SUB>1 </SUB>and X<SUB>2 </SUB>designate hydrogen, lower alkyl or halogen. X<SUB>1 </SUB>and X<SUB>2 </SUB>may be the same or different. n represents a degree of polymerization.) (In the formula 2, X<SUB>1 </SUB>and X<SUB>2 </SUB>have the same meanings as those of the formula 1.) (In the formula 3, X<SUB>3 </SUB>designates hydrogen or a lower alkyl group. Y<SUB>1 </SUB>and Y<SUB>2 </SUB>designate hydrogen or an amino group and both Y<SUB>1 </SUB>and Y<SUB>2 </SUB>are not hydrogens at the same time.)
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