发明名称 |
CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME |
摘要 |
After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained. <IMAGE> |
申请公布号 |
EP1487245(A4) |
申请公布日期 |
2007.05.09 |
申请号 |
EP20030782953 |
申请日期 |
2003.12.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKENAKA, TOSHIAKI;KAWAKITA, YOSHIHIRO;TOJO, TADASHI;TATSUMI, KIYOHIDE |
分类号 |
H05K3/40;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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