| 摘要 |
A transfer unit 10 is structured including a supporting plate 11 having a supporting face 20A for a semiconductor wafer W, an arm plate 30 for supporting the supporting plate 11 and a parallelism adjuster 14 provided between the supporting plate and the arm plate 13. The supporting plate is arranged to be able to intake/discharge the air from the supporting face. Owing to the reaction when the supporting plate comes close to the semiconductor wafer W in the blowing state of the air, the supporting plate is maintained to be parallel with respect to the wafer. After coming close to the wafer in the state that the parallelism is maintained, the wafer is sucked and transferred.
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