发明名称 |
THERMOSETTING COMPOSITION AND CURING METHOD THEREOF |
摘要 |
The invention relates to a thermosetting composition comprising (A) a compound having at least one oxetanyl group in the molecule, (B) a compound having at least two carboxyl groups in the molecule, and (C) an imidazolium salt, curing method thereof and products cured thereby. Cured products prepared from the composition of the invention is excellent in electrical isolation, flexibility, adhesiveness and mechanical strength. |
申请公布号 |
EP1732980(A1) |
申请公布日期 |
2006.12.20 |
申请号 |
EP20050728930 |
申请日期 |
2005.04.05 |
申请人 |
SHOWA DENKO KABUSHIKI KAISHA |
发明人 |
KAMATA, HIROTOSHI;KIMURA, KAZUYA,;UCHIDA, HIROSHI |
分类号 |
C08K5/00;C08G63/91;C08K5/3445;C08L67/00;C08L67/02;C08L101/08;C09J167/02;H05K1/00;H05K3/28 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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