| 摘要 |
<p>The device has a position molded body (10) that exhibits a plane-main surface (14) and a set of recesses (12), which accommodates semiconductor modules (40). Each recess exhibits a stopper, where each main surface of the semiconductor modules is positioned coplanar and aligned to the plane-main surface of the position molded body. The recesses are designed conically and run from another main surface (16) of the position molded body towards the former main surface of the position molded body in a partial section (18). An independent claim is also included for a method for simultaneous surface treatments of a set of power semiconductor modules.</p> |
