| 摘要 |
This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler ( 1 ) comprises lower board member ( 10 ) and upper complex board members. The lower board member ( 10 ) is made from plastic material and has a cavity portion ( 11 ) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member ( 20 ) for a condenser part, upper board member ( 30 ), and board member ( 40 ) for a wick part. The board members ( 20 ) and ( 40 ) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick. The upper board member ( 30 ) includes an opening ( 32 ) or ( 34 ) for allowing the board member ( 20 ) or ( 40 ) for the condenser part or the wick part to be incorporated, and a hollow ( 31 ) for heat insulation.
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