| 摘要 |
In a high-frequency module, intermediate ground electrodes (Go1, Gm1, Gg1, Go2, Gm2, Gg2) are provided between a common ground electrode (Gd) and upper-surface ground electrodes (Gq1, Gq2,) for mounting high-frequency components (21, 22) on an upper surface of a multilayer substrate. With regard to the number of via-hole conductors interconnecting ground electrodes, the number of via-hole conductors (Vdg) between the intermediate ground electrodes (Go1, Gm1, Gg1, Go2, Gm2, Gg2) and the common ground electrode (Gg) is larger than the number of via-hole conductors (Voq) between the upper-surface ground electrodes (Gq1, Gq2) and the intermediate ground electrodes (Go1, Gm1, Gg1, Go2, Gm2, Gg2). |
