| 发明名称 |
Structure for containing desiccant |
| 摘要 |
A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.
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| 申请公布号 |
US7211881(B2) |
申请公布日期 |
2007.05.01 |
| 申请号 |
US20040808068 |
申请日期 |
2004.03.24 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MCKINNELL JAMES;DIEST KENNETH;CHEN CHIEN-HUA |
| 分类号 |
H01L23/02;H01L23/12;B65D81/26;B65D85/90;H01L21/48;H01L23/16;H01L23/26 |
主分类号 |
H01L23/02 |
| 代理机构 |
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