发明名称 Fabricating a photonic die
摘要 In one embodiment, a method includes forming an array of recesses in a substrate, depositing spacer material in the recesses, forming photonic elements on the spacer material, and separating the structure previously formed into individual dies that each include a photonic element, spacer material and substrate.
申请公布号 US7212699(B2) 申请公布日期 2007.05.01
申请号 US20050092489 申请日期 2005.03.25
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 CHEN CHIEN-HUA;BICKNELL ROBERT NEWTON
分类号 G02B6/12;H01L21/00 主分类号 G02B6/12
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