发明名称 Modular implantable medical device
摘要 An implantable medical device for implantation in the head of a patient. The implantable medical device has a plurality of interconnected modules one or more of which are covered by an overmold and one or more of which are partially covered by the overmold. The module(s) covered by the overmold may be implanted between the cranium and scalp, while the module(s) partially covered by the overmold may be placed at least partially into a recess in the cranium.
申请公布号 US7212864(B2) 申请公布日期 2007.05.01
申请号 US20030731638 申请日期 2003.12.09
申请人 MEDTRONIC, INC. 发明人 WAHLSTRAND CARL D.;SINGHAL RUCHIKA;SKIME ROBERT M.
分类号 A61N1/375;A61N1/36 主分类号 A61N1/375
代理机构 代理人
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