| 摘要 |
A semiconductor package module comprising stacked semiconductor packages and a manufacturing method of the same are provided to obtain highly reliable semiconductor package module by fitting conductive pins on a module substrate into pin holes of a semiconductor package, and facilitate height-adjustment of the stacked packages by employing supports to uphold and adjust a gap between the packages. A semiconductor package module comprises a module substrate(30), and a plurality of stacked semiconductor packages(10). The module substrate has a plurality of vertical conductive pins(31) on the opposite sides of its surface. The semiconductor packages have a pin hole vertically penetrating a package substrate and are stacked on the module substrate by the conductive pin fitted in the pin hole. A plurality of supports(22) for holding the semiconductor packages are provided between the stacked semiconductor packages.
|
