发明名称 Wet-processing apparatus, wet-processing method and storage medium
摘要 A wet-processing apparatus includes module groups each including plural processing modules and a shared nozzle device to be used in common by the processing module of the module group. The wet-processing apparatus includes plural processing modules not less than four processing modules, for example, six processing modules. The six processing modules are divided into two module groups, namely, first and second module groups each of the three processing modules. Each of the first and the second module group is provided with a nozzle device for pouring a processing solution onto a wafer. The first wafer is delivered to the first processing module, the second wafer is delivered to the processing module of the second module group, the third wafer is delivered to the processing module of the first module group. Thus the successive wafers are delivered alternately to the first and the second module groups.
申请公布号 US2008070164(A1) 申请公布日期 2008.03.20
申请号 US20070898510 申请日期 2007.09.12
申请人 TOKYO ELECTRON LIMITED 发明人 HAYASHIDA YASUSHI;HARA YOSHITAKA
分类号 G03C5/00;B05B7/00 主分类号 G03C5/00
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