| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate taking-out device and method for taking out only the substrate put at the uppermost position by preventing two substrates from being simultaneously taken out while reducing labor required in a maintenance work of the device as much as possible. SOLUTION: A suction unit 70 is provided with at least a first suction part 702 for sucking only a part close to an upper face end part of the substrate St put at the uppermost position by its suction face. An elevating mechanism 73 lifts or lowers the suction unit 70 and lowers the suction unit 70 down to the position where the suction face of the first suction part 702 and the part close to the upper face end part of the substrate St at the uppermost position approach mutually. The first suction part 702 makes its suction face sucked onto the part close to the upper face end part of the substrate St at the uppermost position. The elevating mechanism 73 lifts the suction unit 70 while the suction face of the first suction part 702 is sucked onto the part close to the upper face end part of the substrate St at the uppermost position. COPYRIGHT: (C)2008,JPO&INPIT
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