| 摘要 |
FIELD: mechanical engineering; soldering. ^ SUBSTANCE: invention can be used at soldering in vacuum of parts made of heterogeneous materials and provided with interconnected inner spaces. Prior to assembling, surface of part made of copper alloy to be soldered is subjected to thermovacuum surfacing with manganese. Surface of steel part is ground. Parts are assembled with guaranteed clearance. Installed into one of spaces are dummy inserts whose number and size are chosen depending on clearance between surfaces to soldered at assembling. Spaces are evacuated and assembly unit is heated to soldering temperature. ^ EFFECT: improved quality of soldered joint of parts made of heterogeneous material owing to elimination of pressure drop in spaces in process of heating. ^ 1 ex, 2 dwg |
