| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with a built-in electronic component with improved yield, and a method for manufacturing the same. <P>SOLUTION: A second substrate 12 is provided above a first substrate 11, an electronic component 13 is arranged between the first substrate 11 and the second substrate 12 so that the electronic component 13 is sealed between the first substrate 11 and the second substrate 12, and a photosensitive resin 14 having adhesion properties is provided to bond the first substrate 11 and the second substrate 12 to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
