发明名称 APPLYING APPARATUS AND APPLYING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an applying apparatus and an applying method by which an applied film of a treating solution can be formed with uniform film thickness on a substrate by accurately controlling height positional relation between a floating stage and the substrate and a nozzle in a float transporting system. SOLUTION: The applying apparatus has the stage 76 which has a 1st float region where the substrate to be treated is floated by gaseous pressure, a substrate transporting section 84 which transports the substrate in a floating state in a predetermined transportation direction and makes the substrate pass the 1st float region and a nozzle 78 which is arranged above the 1st floating region ascendably and descendably. Further the applying apparatus has a treating solution supply section 93 which ejects the treating solution from the nozzle in order to apply the treating solution onto the substrate passing the 1st float region, a nozzle vertically moving section 75 for vertically moving the nozzle and a 1st measuring section 162 which measures thickness of the substrate just before application of the treating solution in the 1st float region and floating height of the substrate with respect to the stage. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007105623(A) 申请公布日期 2007.04.26
申请号 JP20050298679 申请日期 2005.10.13
申请人 TOKYO ELECTRON LTD 发明人 IKEDA FUMIHIKO;IKEMOTO DAISUKE;YOSHITOMI WATARU
分类号 B05C5/02;B05C11/00;B05C13/02;B05D1/26;B05D3/00 主分类号 B05C5/02
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