Method of making light emitting device with silicon-containing encapsulant

摘要

A method of making a light emitting device is disclosed herein. The method includes the steps of: (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition having: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation. The method may further include the step of: (C) applying actinic radiation of 700 nm or less to initiate hydrosilylation within the silicon-containing resin. The method may also include the step of: (D) heating the photopolymerizable composition to less than 150° C. to further initiate hydrosilylation, or (D) simultaneously applying actinic radiation and heat.