| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a ceramic circuit board having few ocurrences of crackings of the ceramic board and a solder even with a repeated thermal history. SOLUTION: The method of mounting electronic equipment to the circuit board with the ceramic board and an aluminum metallic circuit bonded through a bonding layer comprises a step of mounting the electronic equipment by forming a solder layer on the metallic circuit surface located inside not less than 1 mm from the lower part of the end face of the alminum metallic circuit. The ceramic board is an aluminum nitride board, and a purity of the alminum metallic circuit is not less than 99.99 wt.%. COPYRIGHT: (C)2007,JPO&INPIT
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