Distance arrangement method e.g. for components on assembly area of circuit board, involves applying three-dimensional printing in environment of component hole on assembly surface of PCB

摘要

The method involves applying a three-dimensional printing on in the environment of a component hole on an assembly surface of a PCB. Equipment of an element, such as an electrolytic capacitor, is provided inserting into the component into a hole in such a way that the element body is separated by a distance by three-dimensional printing of the assembly surface.