发明名称 ETCHING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an etching method, wherein even in such a case that two or more masks are formed in layers on the surface of a substrate to be treated, an etching operating corresponding to the respective membranes of the masks is completed in a single manner. SOLUTION: The invention relates to a method to etch the substrate on the surface of which two or more masks are formed, wherein multiple etching liquids suitable for respective membranes of the masks are prepared in advance and are discharged continuously in a switching manner. Furthermore, in the etching method, reactive gases corresponding to the respective membranes of the masks may be prepared in advance and discharged continuously in a switching manner as well as reactive gas-soluble liquid may be provided in the atmosphere of the reactive gases. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007107103(A) 申请公布日期 2007.04.26
申请号 JP20070021289 申请日期 2007.01.31
申请人 SEIKO EPSON CORP 发明人 KOIKE TAKASHI;MORI YOSHIAKI
分类号 C23F1/02;C23F1/08 主分类号 C23F1/02
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