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发明名称
HYBRID CHUCK
摘要
<p>Vorrichtung und Verfahren zum Temperieren eines Substrats, insbesondere eines Wafers mittels einer Vorrichtung mit zwei Temperierkreisläufen, die mit unterschiedlichen Temperierfluiden betrieben werden.</p>
申请公布号
WO2007045444(A1)
申请公布日期
2007.04.26
申请号
WO2006EP10019
申请日期
2006.10.17
申请人
ATT SYSTEMS GMBH;EIBL, MARKUS
发明人
EIBL, MARKUS
分类号
H01L21/00;F25B29/00;H01L21/687
主分类号
H01L21/00
代理机构
代理人
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